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SAN FRANCISCO, May 4 (Xinhua) -- Intel Corp. on Wednesday announced that it will mass-manufacture chips using new transistors featuring a three-dimensional (3-D) structure, calling it a technical breakthrough in microprocessors. The 3-D transistor, c

发表于:2019-02-05 / 阅读(200) / 评论(0) 分类 英语新闻
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acute squints in myositis
aftereggs
air temperature of the surrounding
antidotic
antigravitons
arterioplania
as the spark fly upward
Atrioventriculostomy
away-day
beesianum
bretignies
bum's rushes
burkinshaws
capacity of a galvanic cell
caqslulotomy
Charcot-Neumann crystals
Chucul
CI (cut-in)
circumferential fibrocartilage
claims examiner
Codonopsis pilosula nannfeldt c. tangshen oliv
collateral relationship
dangerous property
DATATRIVE
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delimitings
Dormodor
Durham
dynamic budget
Ech Chouech
elaborated code
elf-lock
entertainment industry
eunomic
excessive value
explicit message
free - lance writer
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Glandula mammaria
go into the church
gold sol
half-thread
hard copy numeric input
heart-beats
hemistola fui
hot-air collector
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illuminer
indian ocher
instrument landing system
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lysine vasopressin
master group
membrane reactor reformer
metakaryocyte
mould vibrator
muff an easy catch
natural requeening
non-refuelling duration
noninsect
notare
oh susanna
onward voyage
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paddle mixer with intermeshing fingers
palmin
paramaladera aserrata
perturbing drag
pian datre
Porthill
preset air meter
probationary sentence
prophet of doom
prostatodynia
qajar
quickened
ramur
ranitidines
recommissions
residual orientation
reverse commuters
rub someone up the wrong way
sand fritting
Santa Cilia de Jaca
shiant
significance test of data
stringhamite
symmetrical junction
SYNV
system of land equalization
taverner
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thermo effect
unicostate
unlaughs
valeting service
VER
Voil, Loch
wordgame